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SubCompact Board with Intel® 6th Gen Core U-series Processor SoC

  • Intel® 6th Gen Core U-series Processor SoC
  • DDR4 1866/2133, SODIMM x 1
  • DVI, CRT/DP, 18/24-bit Dual-Channel LVDS/eDP
  • 2 CH Audio
  • SATA III x 1 & mSATA (Half-size)
  • Support 8-bit Digital I/O, USB 2.0 x 2 , USB 3.0 x 4
  • COM x 4 (RS-232 x 1, RS-232/422/485 x 3)
  • Mini-Card Slot x 1 (Full size), TPM, SIM
  • Wide DC Support 9~36V, +12V only
  • 4/5/8-wire Resistive Touch Screen Controller
  • BIO Connector for Daughter Board
  • Solder Design for System Assembly and Thermal
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Specification

Processor

Intel® Skylake-U Processor SoC

Form Factor

SubCompact Board

System Memory

Memory Type DDR4 1866/2133, SODIMM x1, Up to 8GB

Chipset

Intel® Skylake-U Processor SoC

Expansion Interface

BIO x 1, Mini-Card x 2 (default is mSATA x 1half-size, Mini-Card x 1Full-size)

BIOS

UEFI

Wake on LAN

Yes

Watchdog Timer

255 Level

USB

USB3.0 x 4 , USB2.0 x 2

Serial Port

RS-232 x 1 , RS-232/422/485 x 3

Ethernet

Intel® i210, 10/100/1000Base, RJ 45 x2 (Support EtherCAT)

Parallel Port

SPP/EPP/ECP x 1 (Option, share with DIO)

Storage

SATA 3.0 x 1, +5V SATA power connector x 1, mSATA (share with half-size Mini-Card and selective by BIOS)

Audio

High Definition Audio Interface

Display Chipset

Intel® Skylake-U Processor SoC

Display I/O

DVI x 1

Video Output

DVI-I+LVDS, DVI-I + CRT , DVI-I+eDP, CRT+LVDS, CRT+eDP , DP+LVDS

Backlight inverter supply

Up to 24-bit dual-channel LVDS x 2

DIO

8 Bit

TPM

x 1

Touch

x 1

Power Requirement

AT/ ATX +9~36V or +12V

Power Consumption

Operating Humidity

0% ~ 90% relative humidity, non-condensing

Operating Temperature

32°F ~ 140°F (0°C ~ 60°C)

Storage Temperature

-40°F ~ 176°F (-40°C ~ 80°C)

Gross weight

0.88 lb (0.4 kg)

Dimensions(W x D x H)

5.75" x 4" (146mm x 101.7mm)

MTBF (Hours)

TBD

Certification

CE/FCC