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  • 12/13/14th Generation Intel® Core™ LGA 1700 socket-type Processor with Intel® H610E Chipset
  • Wide Operating Temperature (-25°C ~ 70°C)
  • HDMI output x 2
  • GbE LAN x 2
  • USB Type-A x 6
  • RS-232/422/485 x 2, RS-232 x 4 (Optional)
  • Internal 2.5″ SSD bay x 2
  • 10 ~ 35 VDC power input range
  • TPM 2.0 onboard

Specification

CPU

U
12/13/14th Generation Intel® Core™ LGA 1700 socket-type Processor, Max
TDP 65W
13th Generation Intel® Core™ Processors:
Intel® Core™ i9-13900TE, Intel® Core™ i9-13900E,
Intel® Core™ i7-13700TE, Intel® Core™ i7-13700E,
Intel® Core™ i5-13500TE, Intel® Core™ i5-13500E,
Intel® Core™ i3-13100TE, Intel® Core™ i3-13100E,
14th Generation Intel® Core™ Processors:
Intel® Core™ i9-14900, Intel® Core™ i9-14900T,
Intel® Core™ i7-14700, Intel® Core™ i7-14700T,
Intel® Core™ i5-14500, Intel® Core™ i5-14500T,
Intel® Core™ i3-14100, Intel® Core™ i3-14100T,

Chipset

Intel® H610E

System Memory

DDR5 SODIMM x 2, up to 64GB

Display Interface

HDMI x 2, 4K x 2K @30Hz

Storage

2.5” SATA Drive Bay x 2
M.2 2280 M-Key x 1 (PCIe Gen 3 [x4]) for NVMe

Ethernet

Intel® I219-LM, GbE RJ-45 x 1
Intel® I226-LM, 2.5GbE RJ-45 x 1

I/O

USB 3.2 Gen 2 x 4, USB 2.0 x 2
DB-9 x 2 for RS-232/422/485
Audio x 1 (Mic-in/Line-out)
Power Button with power LED x 1
Remote Power On/Off x 1

Expansion

M.2 2280 M-Key x 1 (For NVMe Storage)
M.2 2230 E-Key x 1 (for Wi-Fi/Bluetooth)
Full Size MiniPCIe x 1 (optional for mSATA)
Onboard TPM 2.0

Indicator

System / Storage

OS support

Windows® 10 IoT Enterprise 64-bit
Windows® 11 PRO 64-bit
Linux Ubuntu 22.04

Power Requirement

3-pin DC Input 10~35V

Mounting

Wallmount

Dimension

7.09" x 3.04" x 8.66" (180mm x 77.2mm x 220mm)
8.43" x 3.31" x 8.66" (214mm x 84.2mm x 220mm) with brackets

Gross Weight

8.59 lb (3.9 kg)

Net Weight

6.39 lb (2.9 kg)

Operating Temperature

e
-13°F ~ 131°F (-25°C ~ 55°C), IEC60068-2 with 0.7 m/s AirFlow, with wide
temperature memory/storage (TDP 65W CPU)
-13°F ~ 158°F (-25°C ~ 70°C), IEC60068-2 with 0.7 m/s AirFlow, with wide
temperature memory/storage (TDP 35W CPU)

Storage temperature

-40°F ~ 176°F (-40°C ~ 80°C)

Storage Humidity

5 ~ 95% @ 40°C, non-condensing

Anti-Vibration

IEC60068-2-64, 3 Grms/ 5 ~ 500Hz/ operation (with SSD)

Anti-Shock

50G, IEC60068-2-27, half sine, 11ms duration (with SSD)

Certifications

CE/FCC class A